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Ravichandran, Guruswami
删除限定条件 创造者: Ravichandran, Guruswami
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Elsevier
删除限定条件 出版者: Elsevier
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- 描述:
- Multiscale experiments in heterogeneous materials and the knowledge of their physics under shock compression are limited. This study examines the multiscale shock response of particulate composites comprised of soda-lime glass particles in a PMMA matrix using full-field high speed digital image correlation (DIC) for the first time. Normal plate impact experiments, and complementary numerical simulations, are conducted at stresses ranging from to elucidate the mesoscale mechanisms responsible for the distinct shock structure observed in particulate composites. The particle velocity from the macroscopic measurement at continuum scale shows a relatively smooth velocity profile, with shock thickness decreasing with an increase in shock stress, and the composite exhibits strain rate scaling as the second power of the shock stress. In contrast, the mesoscopic response was highly heterogeneous, which led to a rough shock front and the formation of a train of weak shocks traveling at different velocities. Additionally, the normal shock was seen to diffuse the momentum in the transverse direction, affecting the shock rise and the rounding-off observed at the continuum scale measurements. The numerical simulations indicate that the reflections at the interfaces, wave scattering, and interference of these reflected waves are the primary mechanisms for the observed rough shock fronts.
- 关键词:
- Shock structure, Shock compression, Composite, Plate impact, Digital image correlation, and Meso-scale
- 学科:
- Engineering and Applied Science
- 创造者:
- Lawlor, Barry , Ravindran, Suraj , Gandhi, Vatsa , and Ravichandran, Guruswami
- 贡献者:
- Jio Institute
- Owner:
- n.sakthivel@jioinstitute.edu.in
- 出版者:
- Elsevier
- 位置:
- United States
- 语言:
- English
- 日期上传:
- 21-03-2023
- 修改日期:
- 21-03-2023
- 创建日期:
- 01-02-2023
- Rights Statement Tesim:
- In Copyright
- License Tesim:
- All rights reserved
- Resource Type:
- Article
- 识别码:
- 10.1016/j.jmps.2023.105239